MIC Electronics has signed a memorandum of understanding (MoU) with Singapore-based TOP2 to advance India’s semiconductor ambitions by enabling domestic wafer production.
As part of the agreement, TOP2 will assist MIC in identifying and finalising a Taiwanese fabrication partner, with plans to commence production of 25,000–30,000 wafers per month within India. The collaboration aligns with India’s broader goal of reducing import dependency and building a robust, indigenous chip manufacturing ecosystem. Leveraging existing wafer lines offers a cost-effective and time-efficient alternative to greenfield semiconductor fabs.
MIC and TOP2 will jointly manage technical evaluations, partner negotiations, and operational setup, positioning MIC as a competitive player in the global semiconductor value chain. Notably, TOP2 has already supported the deployment of silicon wafer production lines for three Indian companies in 2025, and plans to enable 2–3 additional lines annually to meet the growing demand from EVs, 5G, AI, and consumer electronics sectors.
This partnership combines technical expertise, international linkages, and execution capabilities, marking a strategic step in India's semiconductor roadmap.
News by Rahul yelligetti.