Hindalco Industries is set to invest ₹586 crore in establishing an integrated aluminium extrusion facility in Kuppam, Andhra Pradesh, with a strategic focus on manufacturing chassis components for Apple’s iPhone.
The project falls under the Andhra Pradesh Electronics Component Manufacturing Policy 2025–30 and is expected to generate 613 jobs over the next four years. Commercial production is slated to begin by March 2027. The proposal is currently under consideration by the State Investment Promotion Board (SIPB).
Officials highlighted Kuppam’s strategic location—closer to Bengaluru Airport than parts of Bengaluru itself, and just 200 km from Chennai—making it ideal for high-value electronics manufacturing. The area benefits from proximity to major industrial and logistics hubs in both Bengaluru and Chennai.
A senior official noted, “The decision reflects not only the importance of Kuppam as the Chief Minister’s constituency, but also its potential to leverage the combined infrastructure of two major metropolitan cities.”
The initiative aligns with Andhra Pradesh’s broader vision to develop Kuppam as a key node in the iPhone supply chain, especially with Foxconn already manufacturing the iPhone 17 in the region. Alongside Hindalco’s proposal, SIPB is also reviewing a ₹1,800-crore investment by Syrma SGS Technology for PCB and copper-clad laminate (CCL) manufacturing.
News by Rahul Yelligetti.