India is preparing to advance its semiconductor mission by moving from 28-nanometre fabrication to cutting-edge 5–7 nanometre chip manufacturing, according to Abhishek Singh, Additional Secretary, Ministry of Electronics and Information Technology.
Singh highlighted the parallel development of assembly, testing, marking, and packaging (ATMP) units alongside fabrication plants, with key industry players like Tata driving the effort. Projects are already underway in Gujarat, Assam, and Odisha, bolstering India’s domestic manufacturing capacity.
While 28nm fabs represent the foundational phase, the government aims to quickly scale to more advanced nodes. This next phase, dubbed “Semiconductor 2.0,” focuses on high-value chipmaking and is supported by design-led incentive schemes. The initiative is expected to elevate India’s position in the global semiconductor value chain and help establish a comprehensive ecosystem for advanced electronics manufacturing.
News by Rahul Yelligetti.