Modi in Sanand: A ₹3,300-Crore Boost for 'Make in India' Chips

Prime Minister Narendra Modi is set to inaugurate Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand on 31 March, marking another milestone in the region’s emergence as a semiconductor hub.

The ₹3,300-crore facility, approved by the Union Cabinet in September 2024 under the India Semiconductor Mission, is designed to produce up to 60 lakh chips per day at full capacity.

The inauguration comes amid a surge of semiconductor investments in Sanand, which is rapidly evolving from an automobile manufacturing base into a key electronics and chipmaking cluster. The region has already seen the launch of a major ATMP facility by Micron Technology earlier this year, along with another OSAT unit by CG Semi, further strengthening its role in India’s semiconductor ecosystem.

The event will also mark the formal launch of Kaynes Semicon’s Multi-Chip Module (MCM). The company had earlier announced the successful rollout and shipment of 900 Multi-Chip Modules (IPM5), assembled, tested, and quality-certified at the Sanand facility, to Alpha and Omega Semiconductor.

News by Rahul Yelligetti.