Milestone in Info Valley: 3D Chip Packaging Arrives in Odisha

The foundation stone for India’s first advanced 3D chip packaging unit was laid on April 19, 2026, at Info Valley in Bhubaneswar, marking a significant step toward strengthening the domestic semiconductor ecosystem and advancing the vision of self-reliance in high-end electronics manufacturing.

Union Minister Ashwini Vaishnaw described the occasion as a “historic day,” noting that Odisha is rapidly emerging as a hub for advanced technology and electronics manufacturing. He highlighted the state’s transition from its traditional strengths in metals and minerals to becoming a key centre for IT and electronics production, calling the development a major milestone in its industrial transformation.

The project is part of a broader national push to build a robust semiconductor ecosystem, with multiple initiatives approved in 2025. These include projects by SiCSem and 3D Glass Solutions. SiCSem, in collaboration with a UK-based partner, plans to set up India’s first commercial compound semiconductor fabrication facility focused on silicon carbide devices for sectors such as electric vehicles, defence, railways, and renewable energy. Meanwhile, 3D Glass Solutions will establish an advanced packaging unit using glass interposer technology for applications in artificial intelligence and high-performance computing.

Officials said the initiatives are expected to attract significant investment, create skilled employment opportunities, and accelerate India’s journey toward self-reliance in semiconductor manufacturing, while also boosting Odisha’s emerging semiconductor ecosystem.

News by Rahul Yelligetti.